中文簡介

IEEE關(guān)于組件、封裝和制造的交易涵蓋了以下內(nèi)容領(lǐng)域：建模、設(shè)計、構(gòu)建模塊、技術(shù)基礎(chǔ)設(shè)施和支持電子、光子和MEMS封裝的分析，以及無源組件、電氣觸點和連接器、熱管理和設(shè)備可靠性方面的新發(fā)展；以及電子零件和總成的制造，具有廣泛的設(shè)計、工廠建模、裝配方法、質(zhì)量、產(chǎn)品魯棒性和環(huán)境設(shè)計。IEEE技術(shù)協(xié)會的會員資格提供了訪問頂級出版物的機會，如作為會員利益或通過折扣訂閱。該雜志的電子版是CPMT協(xié)會會員的一部分，但也提供所有媒體類型的購買。

　　英文簡介

IEEE Transactions on Components, Packaging, and Manufacturing covers the following content areas: modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.Membership in IEEE's technical societies provides access to top quality publications such as this one either as a member benefit or via discounted subscriptions. The electronic version of this journal is part of the CPMT Society membership, but all media types are also offered for purchase.

　　近年期刊自引率趨勢圖

　　JCR分區(qū)

JCR分區(qū)等級	JCR所屬學(xué)科	分區(qū)	影響因子
Q3	ENGINEERING, ELECTRICAL & ELECTRONIC	Q3	1.922
	ENGINEERING, MANUFACTURING	Q4
	MATERIALS SCIENCE, MULTIDISCIPLINARY	Q4

　　近年期刊影響因子趨勢圖

　　CiteScore數(shù)值

CiteScore	SJR	SNIP	學(xué)科類別	分區(qū)	排名	百分位
4.10	0.623	1.032	大類：Engineering 小類：Industrial and Manufacturing Engineering	Q2	109 / 338	67%
			大類：Engineering 小類：Electrical and Electronic Engineering	Q2	254 / 708	64%
			大類：Engineering 小類：Electronic, Optical and Magnetic Materials	Q2	106 / 259	59%

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